Thermal separation technology of copper substrate

Thermal separation technology of copper substrate

Thermoelectric separation technology refers to the circuit part of the substrate and the thermal layer part in different line layers, the thermal layer part directly contact with the lamp bead heat dissipation part, to achieve the best heat dissipation and heat conduction, generally copper substrate. Now let the engineer explain the thermoelectric separation technology of copper base plate in detail.

I. Advantages:

1, the selection of copper substrate, high density, strong heat carrying capacity of the substrate, good heat conduction and heat dissipation.

2, the thermoelectric separation structure, and the lamp bead contact zero thermal resistance, prolong the lamp bead life.

3. Copper substrate has high density, strong thermal carrying capacity and smaller volume under the same power.

4, suitable for matching a single high-power lamp bead, so that the lamp to achieve better results.

5, according to different needs can be a variety of surface treatment, surface treatment layer reliability is excellent.

6. Different structures can be made according to different design needs of lamps and lanterns.

Two, disadvantages: not suitable for single electrode chip bare crystal packaging.

Three, thermoelectric separation of copper substrate technology steps:

1. Cut the copper foil substrate into the size suitable for processing and production.

2. Before pressing the substrate film, brush grinding, micro-etching and other methods are usually required to do appropriate coarsing treatment of copper foil on the surface of the substrate.

3. With appropriate temperature and pressure, the dry film photoresist is tightly attached to it. The photoresist will produce polymerization reaction after ultraviolet irradiation in the light-transmitting area of the negative, and the line image on the negative will be transferred to the dry film photoresist on the surface of the plate.

4, tear off the protective adhesive film, first with sodium carbonate aqueous solution will not be exposed to light area development removal, and then with hydrochloric acid and hydrogen peroxide mixed solution will be exposed copper foil corrosion removal, forming a line.

5. Remove the dry film photoresist with sodium hydroxide aqueous solution. For more than six layers (including) of the inner circuit board with automatic positioning punching machine out of the interlayer line alignment of the riveting reference hole.

The above is the engineer to explain the copper base plate thermoelectric separation technology in detail for you, you have mastered