miniLEDHDI small-pitch LED circuit board production

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Specializing in the production of LED small pitch HDI

Product field: LED small pitch HDI

LEDHDI product structure and number of layers: 4-12L, 1-4 level blind buried vias

Process structure: material FR-4＋TG150 or TG180, minimum hole 0.11mm, copper thickness 1~2OZ, line width and line spacing 3/3Mil, impedance ±10%Ω, deep sinking process, blind fishing, blind drilling, small spacing 0.105-0.12mm ,

LED finished board thickness: 0.60mm-3.50mm

Current LED product size: 700*1350mm

2. Single and double LED products

2.1. Material FR-4 TG130 or high TG

2.2. Board thickness: 0.50~8.0Mm

3.3. LED finished product size produced by Chaosheng

3.1: Produce large size PCBcnc drilling machine size: 2400*1100Mm, can drill 2100*1200mm

3.2: Fully automatic large-size wire brushing machine for producing large-size PCBs, limited to double layers: 2200*100毫米

3.3: The optical machine equipment for producing large-size PCBs is limited to double-layer size: 2000*100毫米

3.4: The electroplating steel tank equipment for producing large-size PCBs is limited to double-layer size: 2000*100毫米

3.5: The etching line width equipment for producing large-size PCBs is limited to double-layer size: 1200mm

3.6: Laminating equipment for producing large-size PCBs. Multilayer size: 1550*700mm (limited to 4-12 layers)

3.7: The minimum line width and line spacing of large-size PCBs are more than 5/5mil

3.8: Producing large size pcb, the minimum solder mask unilateral opening distance is 0.12mm

3.9: The smallest hole for producing large size pcb is 0.50mm

3.10: Production of large-size CNC outline equipment length and width dimensions: 2600*1200mm

3.11: Production of large size testing machine equipment length and width size: 2400*1200mm

3.12: Production of large size V-CUT equipment with a width of "1300Mm

3.13: Width of large-size OSP equipment: 1100Mm

3:14: The equipment size of the large-size immersion gold production line: 1500*700mm

3.15: The equipment size of the large-size electro-nickel gold production line: 1300*700mm

3.16: Production of large-size vacuum packaging equipment: 1300*700mm

3.17: Production of large-size solder paste printer equipment size: 2100*910Mm

3.18: Production of large-size SMT equipment width size: 1600*900Mm

3.19: Production of large-size reflow soldering equipment size: 1600*900Mm

3.20: Production of large-size multi-layer boards of production size, finished board thickness 0.50-7.0Mm±10%

3.21: Production of large-size multilayer boards with an impedance value of ±10%

Chaosheng produces LED products with 4~16 layers of through-hole finished size