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SMT process technical problems
SMT process technical problems SMT, surface-mount Technology  Surface Mount Technology  SMC - Surface Mount component  Surface Mount Componet  SMD - Surface Mount Device  Surface Mount Device  SMB - Surface Mount PCB  Surface Mount Printed Circuit Board  THT - through hole interpolation technology MSI - medium scale integrated circuit LSI - large-scale integrated circuit The advantages of SMT  The products of the 1yuan pieces are of high value and light weight. The strong resistance is strong. High frequency is very good. It is easy to be effective and effective. 5  can reduce the cost. Eight major technical problems of SMT  management engineering  test  material  equipment  process   substrate  graphic design of components. The conditions of a tin plaster Solder paste is a paste made of alloy solder powder, paste flux and some additives The shape of body. It is a homogeneous, stable mixture. At the same time, the electronic components of the electronic components will be placed in a paste Heat to a certain temperature when  as evaporation of solvent and some additives, alloy melting  reflow solder paste made by welding components and solder interconnection A solder that is cooled to form a permanent connection. It is a good idea to have a good printable and resoled solder Stability. The welds need to be specific 1,   with long storage life is saved in 2 ~ 5 degrees when storing  3 ~ 6 months will not change chemical  also won't appear the solder powder And the welding of the present and separation of the present and the adhesion and adhesion. 2, small  hygroscopicity, low toxicity, odorless, non corrosive. 2. It is very special in the application of the application. 1,  good printing and drop with sexual  membranous off good  can continuous smooth coating  not clogged screen or leakage of plate Kong eye and the injection of the mouth of the mouth are not to be spout. 2,  have longer working life luck  usually required after printing or drop in room temperature can be placed 12 to 24 hours  its performance remains the same. 3,  during reflow soldering preheating  solder paste should keep its original shape and size  does not produce damage. Collapse refers to a certain volume of solder paste  after printing or drops on PCB due to the effect of gravity and surface tension and temperature increase or reduce the height of parking time is too long and cause  The present situation of the end of the boundary is called a collapse. 3. Characteristics of reflow welding with heating 1,  good wettability. The preparation and preparation of the preparation of solder and wetting preparation should be used for the purpose of wetting and wetting. 2, solder splash  will not occur. It is mainly depended on the water absorption of solder paste, the type of solvent in solder paste, boiling point and dosage and solder powder Type and content of impurity. 3,  formation, the least amount of solder ball. The characteristic of recurrent welding 1,  better  ensure that will not happen due to factors such as vibration strength of welding components fall off. 2   residues after welding stability performance is good  non-corrosive  have higher  insulation resistance and good cleaning. 2 ,  affect solder paste properties of some important parameters 1  viscosity The welding paste is a kind of fluid to be able to be able to use the power of the external force to produce the power of printing and re-flow-welding. Welding paste in printing time from the beginning of the use of the blade pressure of the use of the blade pressure Degree of state  to leave accurate graphic on the PCB. 2  the alloy solder powder composition, ratio and the content of flux The composition of solder powder and flux in solder paste and the matching of the two are greatly affected. Alloy welding powder is the main component of the paste in the area of the paste heavy weight of 85%~ 90%. Several kinds of tin-used solder powder - lead  Sn Pb , tin, lead, silver  Sn Pb - Ag , tin, lead, bismuth  Sn Pb - Bi , etc. The most commonly used alloy components are Sn63 / Pb37 and Sn62 / Pb36 / hf-solvated Ag2  Sn63 / Pb37 of melting point is 183 ℃  eutectic state  melting point is 179 ℃ after mixed with 2% of silver  There is a good and good physical characteristic and good quality of welding Mechanical strength of solder joints. 3  melting point Sn63 / Pb37 -- -- -- -- -- 183, Sn62 Pb36 / hf-solvated Ag2 -- -- -- -- -- 179, Sn43 Pb43 / Bi14-114 ~ 163, Sn96.5 / Ag3 Cu0.5-217 4. The form and granularity of the alloy powder In order to avoid the oxidation of tin powder  need spherical powder  because the area of the spherical minimum  area within a certain capacity is the smallest. And at the same time The spherical volume manufacturing bulky  can reduce the scope of the oxidized. The common use of particle size 20~ 45umis to be more and more delicate Type of body welding trend  is bound orientation of powder particle size distribution more narrow, more fine powder. Usually the size of the tin powder is a thickness of about a third has to print the following  and plate opening of about one 5 of the minimum range of the following most As the standard. But the smaller the particle size also has its disadvantages  (1) with a total area of the larger  easy oxidation   3. (2) than a fine solder balling extension and after welding Less intense. 5 contact and collapse 1) the metal content is much higher than 90% The time can be changed and the collapse of the paste is filled with the solder The effective anti-stop tin ball for the effective anti-stop tin ball is the printing and welding The process requirements are stricter. Metal content is smaller than 85% The printing of good and wettable, but the lack of a point is the collapse of the silosphere and the short road. 6 working life and storage life 3  welding agent The use of the solder is required The effect of flux  (1) to remove oxide on the surface of the metal and small acidification  (2) covering the heating of the metal surface  prevent oxidation  3 again The surface tension of the soldering flux. And the essential thing is A solder and solder alloy powder is mixed evenly. B is to use high boiling point solvent to prevent and refloat the product. (c) high adhesion and welding powder and soldering preparation. (d) low absorption and moisture protection against the splats of the steam. (e) low chloride content. 2 welding preparation Active agent, film former, wetting agent, stabilizer and solvent  to improve adhesion, thixotropy and printing  also need to add adhesive, Thickening agents, thixotropic agents and other additives. The composition of solder is extensibility, wettability, collapse degree, viscosity change, cleaning and bead Splash and storage life have a great impact. 1-2 lowering the surface tension of the tin 1-3. The internal surface of the net is low 2-1  to remove oxide film  reactive temperature > 100 degrees 3-1printing time internal mechanical pressure resistance 3-2adhesive reply The time and time of the inner surface of the net of 3-3 steel paste is low High temperature resistance 4-1adhesion time internal retention boiling point 220-290degrees 4-2  SHELF LIFE to keep The solder can be solderable in 50%-60% The surfactant is 10% weldable Conformal agent 15% printing is effective Solvent 15-25% The same kind of preparation and cleaning 1  inorganic flux  need clean water to wash, hot water washing Flux   resin rosin R class 2  without cleaning Mild active RMA does not require cleaning Cleaning solvent should be cleaned High activity RA class needs cleaning solvent cleaning 3  water-soluble flux  need clean water to wash, hot water washing High boiling point solvent The use of high boiling point solvent and increase of content can cause soldering in solder paste. The temperature should be higher and higher in the square method B warm-up time The peak temperature of c increases D high moisturizing cream Printing matters 1. The printed sheet is attached to the surface of the substrate and the printing requirements of 0.1mmms are required 0.15mmmminterplay to prevent the removal of the defects and the need for slow printing. 2. The blade will be processed and repaired at the same time. 3. The surface of the board is applied to the electrode with a soft cloth and a soft cloth The surrounding area produces tin balls. 4. In the front and rear of the printing time, the base board must be the base plate The two ways to make up the law are to shift the printing of the printing and the auxiliary board. Six ways of doing things 1,  will stored in the refrigerator  2 ~ 10 ℃  The mixture of tin powder and liquid soldering preparation is the product of chemical change. so It is necessary to release the products in cold storage. 2,  frost of solder paste to place 4 ~ 8 hours at room temperature  make it back to normal temperature before open. Solder paste is used by most avoid moisture  flux rosin, low solvent, resistance to moisture absorption  and foreign water spillage caused solder ball Bad phenomena. 3,  open after use stainless steel rods  stirring about 2 minutes to make it even and increase the activity of the solder paste. 4, general solder paste  dosage depends on the printing area size. It is not important to have a lot of free and free splattering The end of the world is well - done. Keep the tin cover in place and set aside for standby. 5,  fill quantity to was about to call it a day going to  don't  still retained too much solder paste on the print. Collect the work to prepare for another empty bottle collection printing machine. The propellant of the tin-plaster was overturned and overturned The machine will absorb the air and gas in the air, and lose the maximum amount of time. yeah In the use of recycled tin-plaster to mix with the mixture of the new 2old 1. 6 collection and receiving of tin paste method In
Japan Chuanshan Circuit Board Equipment Co., Ltd. was established in 1982, has experienced more than 30 years of growth and development. Over the years, we are committed to the development and manufacture of circuit board equipment for the circuit board industry to provide superior quality products and high quality Our main products include: Horizontal Wet Process Line, Cabinet and Tunnel Oven and Peripheral Automation Equipment. 1982 - 2008 We focus on Japan and Europe and the US market, 2010 We are in China And Southeast Asia and other regions, serving more than 500 circuit board manufacturers, is Japan's largest manufacturer of circuit board equipment one of the superior production results, handy operation, simple and efficient maintenance and safe and reliable operating system design concepts are It is the leading edge of the circuit board equipment industry, and has always been committed to the development and manufacture of circuit board equipment and ISO quality management system international standard. It is the quality of continuous operation of Chuanshan The company has developed a quality manual that meets ISO requirements, identifies service standards, document control systems, and speaks for all Related courses, in August 1985 and August 1990, respectively, passed the ISO-900 and ISO9001: 2000 BSI international certification. In September 1995, Chuan Shan successfully passed DNV certification CE, which not only proved that the Chuan Shan The results of efforts over the years, but also fully shows that we have been in progress, to make better products and efforts to enable customers in the production process as well as product quality to obtain greater protection.We use high precision CAD / CAM and the most Advanced simulation system to establish the unit structure, to its program, greatly improving the stability and reliability of the machine.We believe that advanced machinery and equipment and continuous improvement of production technology is the guarantee of high quality products.Therefore, we continue to introduce A large number of automated production systems, coupled with professional technical staff to meet the increasing quality of customer requirements. Chuan Shan has more than 1,000 professional technical staff, in accordance with the requirements of the project, provided by the Department of professional design and specification review, production Responsible for precision manufacturing and assembly, QC is rigorously tested to ensure the high quality of the product.With the increasing technical requirements of the industry, we have systematically More than 80 professionals from Japan and the United States are responsible for the development of research work, through their rich experience, the development of more advanced production technology and the development of high-quality, high-precision, Products, so that Katsuyama to maintain the leadership position in the market.In order to allow customers to fully appreciate the spirit of service Sichuan, we consider the needs of customers from various aspects and provide assistance; such as technical support, the effective supply of spare parts and professional advice To provide, etc. There are well-trained technical staff responsible for the installation of the machinery and equipment, operation training and maintenance works, Mu can provide the most complete after-sales service. Welcome to have the skills of the community to join!