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PCB blind board production knowledge
            PCB blind board production knowledge With the development of electronic products to high density and high precision, corresponding requirements have been put forward for pcb. The most effective way to improve the PCB density is to reduce the number of through holes, and to set the blind holes accurately. 1. blind hole definition A: with the through hole hole relatively, refers to all the layers of drilled holes, blind holes are drilled hole. (illustrated, for example: eight plate hole, blind hole, buried hole) B: blind blind (BLIND HOLE) segments: BURIED, HOLE (outer buried hole can not see); C: distinguished from the production process: the blind hole in the pressing before drilling, and drilling in the through hole is pressed. 2. making method A: drilling belt: (1) select the reference point: select the through hole (that is, one hole in the first drilling belt) as the unit reference hole. (2) each drill hole needs to select a hole to mark the coordinate of the reference hole of the unit. (3) Note: a drill with which a few corresponding layers: unit and drill hole chart table are defined, and before and after the name to be consistent; not with the a B C said the hole chart, and again in front of 1st, 2nd said the situation. Note that when the laser hole is embedded with the inner hole, i.e., the holes of the two drill belts are in the same position, the position of the laser hole must be asked to ensure the electrical connection. B: produce PNL plate side process hole: Plain multilayer: No drilling in the inner layer; (1) rivets GH, AOI, GH, et and GH are all played out after etching (beer out) (2): target hole (drill hole GH) CCD: outer layer needs to dig copper skin, X-ray machine: direct hit, and pay attention to long side, minimum is 11inch. Blind plate: All tooling holes are drilled out, attention rivet GH; need beer out, avoid contraposition deviation. (AOI GH also for beer out), the production of PNL plate edge need to drill words, to distinguish each board. 3.Film modify: (1): film indicate a positive, negative: General principle: the plate thickness is greater than 8mil (not even copper) positive process; The plate thickness is less than 8mil (without copper) go negative processes (sheet); Thick line line gap should be considered when the d/f Valley at the copper thickness, rather than the bottom copper thickness. Blind hole ring can do 5MIL, do not have to do 7mil. The inner layer of the blind hole corresponding to the independent pad shall be retained. Blind hole can not be done without ring hole. 4. process: The hole plate is consistent with the common double sided plate. One side of the blind hole plate is an outer layer: Positive flow: need to do a single d/f, not the wrong side reel (double bottom copper is inconsistent); d/f exposure, covered with black tape light copper surface, prevent light. Because the blind plate made of electricity, more than two times in figure, finished easily thick thick, so the electric control board diagram note thick copper thickness, after etching copper plate thickness specified range. After pressing the end of the board, use X-ray machine to print out multi layer board with target hole. Negative processes: according to the "12mil" copper sheet (even because it is unable to pull in map production, we must be in the water and water production, we cannot play surface current, so it is unable to do not play according to the requirement of MI single current or small current. Such as positive process, often leads to a single copper thick ultra thick, resulting in etching difficulties, fine line phenomenon, so that the board needs to go negative processes. The drilling sequence of 5. through hole and blind hole is different, and the deviation is different when making Blind plate is easy to deform, open horizontal multilayer materials on the alignment and tube position distance control is difficult, it is expected to open only open or open only direct material transverse material. 6.Laser drill LASER DRILL is one of the blind hole, has its own characteristics: Aperture size: 4 - 6 mil PP thickness must be "=4". 5MIL, calculated according to aspect ratio =0.75:1 There are three kinds of PP: LDPP 1061080; FR4 1061080; RCC. 7. how to define the buried plate with resin filling A.H1 (CCL): H2 (PP) > =4 thickness ratio B.HI (CCL) 32, MIL C.2OZ and 2OZ laser hole plate; high thick copper and high Tg plate should be sealed with resin. This process should pay attention to the first plate Andante with resin sealing line to do to avoid great damage on the line.
Japan Chuanshan Circuit Board Equipment Co., Ltd. was established in 1982, has experienced more than 30 years of growth and development. Over the years, we are committed to the development and manufacture of circuit board equipment for the circuit board industry to provide superior quality products and high quality Our main products include: Horizontal Wet Process Line, Cabinet and Tunnel Oven and Peripheral Automation Equipment. 1982 - 2008 We focus on Japan and Europe and the US market, 2010 We are in China And Southeast Asia and other regions, serving more than 500 circuit board manufacturers, is Japan's largest manufacturer of circuit board equipment one of the superior production results, handy operation, simple and efficient maintenance and safe and reliable operating system design concepts are It is the leading edge of the circuit board equipment industry, and has always been committed to the development and manufacture of circuit board equipment and ISO quality management system international standard. It is the quality of continuous operation of Chuanshan The company has developed a quality manual that meets ISO requirements, identifies service standards, document control systems, and speaks for all Related courses, in August 1985 and August 1990, respectively, passed the ISO-900 and ISO9001: 2000 BSI international certification. In September 1995, Chuan Shan successfully passed DNV certification CE, which not only proved that the Chuan Shan The results of efforts over the years, but also fully shows that we have been in progress, to make better products and efforts to enable customers in the production process as well as product quality to obtain greater protection.We use high precision CAD / CAM and the most Advanced simulation system to establish the unit structure, to its program, greatly improving the stability and reliability of the machine.We believe that advanced machinery and equipment and continuous improvement of production technology is the guarantee of high quality products.Therefore, we continue to introduce A large number of automated production systems, coupled with professional technical staff to meet the increasing quality of customer requirements. Chuan Shan has more than 1,000 professional technical staff, in accordance with the requirements of the project, provided by the Department of professional design and specification review, production Responsible for precision manufacturing and assembly, QC is rigorously tested to ensure the high quality of the product.With the increasing technical requirements of the industry, we have systematically More than 80 professionals from Japan and the United States are responsible for the development of research work, through their rich experience, the development of more advanced production technology and the development of high-quality, high-precision, Products, so that Katsuyama to maintain the leadership position in the market.In order to allow customers to fully appreciate the spirit of service Sichuan, we consider the needs of customers from various aspects and provide assistance; such as technical support, the effective supply of spare parts and professional advice To provide, etc. There are well-trained technical staff responsible for the installation of the machinery and equipment, operation training and maintenance works, Mu can provide the most complete after-sales service. Welcome to have the skills of the community to join!