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Ceramic PCB Technology
Ceramic PCB Technology Refers to a circuit board made of ceramic substrate. A ceramic substrate is a special process board whose copper foil is bonded directly to aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sides) at high temperature. Ultrathin composite substrate made with excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and like the PCB board can etch a variety of graphics, with large current carrying capacity. Therefore, ceramic substrate has become the basic material of high-power power electronic circuit structure technology and interconnection technology. Comparison of plastic and ceramic materials So far, especially plastic epoxy resin as a result of the economic good to occupy the entire electronic market dominance, but many special fields such as high temperature, linear expansion coefficient mismatch, air tightness and stability, mechanical properties and other aspects are obviously not suitable, organic bromide added a lot of no avail even in epoxy resin.   Compared with plastic materials, ceramic materials play an important role in the electronic industry. They have high resistance, high frequency characteristics, and have high thermal conductivity, good chemical stability, high thermal stability and high melting point. In the design and manufacture of a great need for these performance of electronic circuits, it is widely used in ceramic substrate materials with different thick film, thin film and circuit, can also be used as an insulator, in the heat conduction path demanding performance requirements in the circuit and used for the manufacture of various electronic components. Manufacturing ceramic substrate Ceramic substrate manufacturing high purity is very difficult, most of the ceramic melting point and hardness is very high, which limits the possibility of ceramic machining, so the ceramic substrate often doped with low melting point glass for fluxing or bonding, so that the final product is easily machined. Al2O3, BeO, AlN substrate preparation is very similar to the process, the substrate material grinding into powder in a few microns in diameter, and different glass fluxing agent and adhesive (including powder MgO, CaO) mixture, in addition to the mixture by adding some organic binders and different plasticizers to prevent agglomeration of milling components. Uniform, forming different, finally, high temperature sintering. The ceramic molding mainly has the following several methods: The basic roller rolling: the slurry is sprayed onto a flat surface, dried to form viscosity like putty Tuile, then slice into a pair of parallel roller shaft in the milling has the uniform thickness of porcelain. Sales: casting slurry by coating the sharp blade in a moving belt forming sheet. This is a low pressure process compared to other processes.   Sales: powder in the powder pressing die out cavity and put a lot of pressure (about 138MPa) sintering, despite the uneven pressure may cause excessive production of sintered part warpage but this process is very compact, small tolerance.   An isostatic powder compaction process: the use of water or die and around the use of glycerol as high as 69MPa pressure the pressure is even smaller components made of warp.   An extrusion slurry through the die extrusion process using the slurry viscosity is low, it is difficult to obtain a smaller tolerance, but this process is very economical, and can be thinner than other methods of components. The relationship between circuit board, ceramic substrate and LTCC LTCC means the LTCC, because silver maximum sintering temperature is 920 DEG C, in order to ceramic cloth of silver, so the low temperature CO fired. If the silver line was printed on the inside and on the surface of ceramic and ceramic, and cooked together, which is the so-called ceramic substrate, LED lamp and radiating ceramic plate below two lead layer function is a ceramic substrate, of course there is not firing substrate, the circuit board is mostly composed of organic raw materials. We achieve greater integration in order to expect now, put a lot of inductance capacitance resistance integrated in PCB board, and most of these are ceramic raw materials, the demand of high-temperature sintering, PCB can not burn, you would think of good performance and insulating ceramic plate can be sintered at high temperature, with ceramic dielectric constant is adjustable Strength Seiko is one of the few enterprises that can produce ceramic substrate printed circuit. 48 hours fast production can be achieved. To meet the research and development needs of scientific research and teaching institutions; to reduce the R & D cycle of new products and to seize the market opportunities; to tailor and design for customers, and to rapidly produce and help solve customer design and R & D problems. U fast: rapid processing of ceramic circuit model; U flexible: no limit circuit and metal thickness; U shaped: ceramic shape and hole without limit; U convenient: the metal layer pre eutectic solder pad processing. Major products: Ceramic substrate PCB samples and small batch Allegro -- taking inorganic ceramic material of alumina, aluminum nitride or beryllium oxide as insulating layer, copper, silver and gold as conductive materials, process for the preparation of monolayer or multilayer circuit board electronic packaging. U AlN single / double-sided copper clad U AlN thin film circuit U Al2O3 single / double-sided copper clad U Al2O3 thin film circuit Main substrate: U alumina ceramics - instead of direct bonded copper (DBC) process - Al2O3 substrate with high reliability, high thermal conductivity - excellent mechanical strength, tensile strength of >5N/mm2 - low processing cost, and is suitable for civil promotion U aluminum nitride ceramic - instead of direct bonded copper (DBC) process - AlN substrate with high reliability, high thermal conductivity (lambda > 150 W/m - K) - excellent mechanical strength, tensile strength of >5N/mm2 - high thermal conductivity, heat dissipation of high power devices need to meet Process characteristics: - by magnetron sputtering, graphic lithography, dry
Japan Chuanshan Circuit Board Equipment Co., Ltd. was established in 1982, has experienced more than 30 years of growth and development. Over the years, we are committed to the development and manufacture of circuit board equipment for the circuit board industry to provide superior quality products and high quality Our main products include: Horizontal Wet Process Line, Cabinet and Tunnel Oven and Peripheral Automation Equipment. 1982 - 2008 We focus on Japan and Europe and the US market, 2010 We are in China And Southeast Asia and other regions, serving more than 500 circuit board manufacturers, is Japan's largest manufacturer of circuit board equipment one of the superior production results, handy operation, simple and efficient maintenance and safe and reliable operating system design concepts are It is the leading edge of the circuit board equipment industry, and has always been committed to the development and manufacture of circuit board equipment and ISO quality management system international standard. It is the quality of continuous operation of Chuanshan The company has developed a quality manual that meets ISO requirements, identifies service standards, document control systems, and speaks for all Related courses, in August 1985 and August 1990, respectively, passed the ISO-900 and ISO9001: 2000 BSI international certification. In September 1995, Chuan Shan successfully passed DNV certification CE, which not only proved that the Chuan Shan The results of efforts over the years, but also fully shows that we have been in progress, to make better products and efforts to enable customers in the production process as well as product quality to obtain greater protection.We use high precision CAD / CAM and the most Advanced simulation system to establish the unit structure, to its program, greatly improving the stability and reliability of the machine.We believe that advanced machinery and equipment and continuous improvement of production technology is the guarantee of high quality products.Therefore, we continue to introduce A large number of automated production systems, coupled with professional technical staff to meet the increasing quality of customer requirements. Chuan Shan has more than 1,000 professional technical staff, in accordance with the requirements of the project, provided by the Department of professional design and specification review, production Responsible for precision manufacturing and assembly, QC is rigorously tested to ensure the high quality of the product.With the increasing technical requirements of the industry, we have systematically More than 80 professionals from Japan and the United States are responsible for the development of research work, through their rich experience, the development of more advanced production technology and the development of high-quality, high-precision, Products, so that Katsuyama to maintain the leadership position in the market.In order to allow customers to fully appreciate the spirit of service Sichuan, we consider the needs of customers from various aspects and provide assistance; such as technical support, the effective supply of spare parts and professional advice To provide, etc. There are well-trained technical staff responsible for the installation of the machinery and equipment, operation training and maintenance works, Mu can provide the most complete after-sales service. Welcome to have the skills of the community to join!