Japan group chip packaging factoryChaoShenghonorChao Sheng group frameworkChao Sheng Groupchao Sheng introductionKunYing introductionShenzhen Mingze Electronics(PCBA)PCB equipment plantRise introduction circuitIntroduction to Foundry CompanyChaoShengGroupChinese companiesCircuit board equipment productionPCB equipment plantChao Sheng GroupChao Sheng GroupList of main equipmentsocialresponsibilityChaoShengbusiness philosophyTechnicalProcess and application ofEnterprise core valuesCeramic PCB Technologycorporate cultureThe company's main product areasSpecial material PCB, process technologyHDI blind hole techniqueQuality assurance and controlQMS Full Process QualityControlFull process traceability controlFactorysetuphistoryhistoryFirst, thespiritofenterpriseteam buildingQualityAssurance SystemQualitypolicyCorporate financeEnterprise survival wayChaosheng Electronics specializes in the productioChaosheng Company's main product structure and proMochipsintegratedenvironment light sensor IC ageSMT process technical problemsHDI small-pitch LED circuit board factoryP0.93LED small-pitch printed circuit boardSpecial PCB product seriesTake customer as centePCB chemicalRadiating technology of optical communicationHardware ElectronicsERP management systemMain machinery and equipment listPCBworkshop main equipmentFully self-vacuum plating, hole-filling productionAutomatic solder mask printing production lineFPCworkshop mainequipmentSingle and double-sided FPC automatic roll-to-rollSpecial equipment (extra long size)SMT shop equipmentSMT real shot full process production workshopICpackaging workshop equipmentPCB equipment workshop equipmentHardwareelectronic workshop main equipmentPCB chemical plant main equipmentHDIproductsUltra thin PCB typeSpecial size (extra long, extra wide) PCB, FPCSoft and hard combination and combinatSingle、double、multilayer FPCCombination ofsoftandhardHDIFPCPCBA product fieldThrough-hole double-sided multilayerPCBIC packagesubstrate PCBCavityBoardspcbEquipmentfieldMochipsintegrated environmentlight sensorICPCB chemical productsHardware and electronic productsPlastic electronic productsApplicationsMaterial: FR4PCB, FPC surface treatment process categoriesThe most comprehensive plating knowledge in histor6 ways to reduce the rate ofPCBdefects in carsHow to improve the thermal reliability of PCB circStrengthsPCB blind board production knowledgeWelcome to contact us!recruitWelcome to contact us!
HDI blind hole technique
           Interconnect HDI blind hole PCB production knowledge HDI PCB & High Density Interconnect Arbitrary orderPCB Compare to standard Rigid PCB, HDI PCB request much higher wiring density with finer trace and spacing, smaller vias and higher connection pad density. Blind and buried vias'design is one of their marked feature.HDI PCB ,Automotive, communications, medical, aerospace, aviation, tablet computer, digital camera, GPS, LCD module and other different area. The advantages of HDI PCB include: Reduce the cost Better reliability Increase the wiring density Increase design efficiency Can improve the thermal properties In favor of the use of advanced packaging technology Has better electrical performance and signal correctness Can improve the radio frequency interference, electromagnetic interference and electrostatic discharge Currently the advanced HDI technology we used include: "Copper Filled" “Resin filling”，for special stack microvia, "Laser Direct Imaging"(LDI) is specifically designed for fine line technology, to eliminate dimensional stability problem of artwork caused by environmental and material issues. "Direct Laser Drill"(DLD) is drilling of copper layer by direct CO2 laser irradiation, compare to additional laser drilling with conformal mask, the copper direct laser drilling is capable of providing higher accuracy, better hole quality and better efficiency for HDI projects General Specification for HDI PCB Layer Count: 4-60Layers Type of stack up: 1+N+1,2+N+2， 3+N+3，5+N+5 Material Available: FR4, High Tg FR4, Halogen Free FR4，High frequency mixing of MC24M, 3M, SOAL, Connie, Rogers, Teflon, DuPont, Panasonic, Taiyao, Taiguang; Board thickness: 0.4-3.6mm Finished copper thickness: 1/3oz – 3oz Min trace width/spacing: 3/3mil Min through hole: 0.2mm Min blind via: 0.1mm Surface treatment: Immersion Gold, ENIG + OSP 1. High-density interconnection/HDI PCB Layer: 36(HDI) Structure: 5+N+5 Material: FR4, High Tg FR4, Halogen Free FR4，High frequency mixing of MC24M, 3M, SOAL, Connie, Rogers, Teflon, DuPont, Panasonic, Taiyao, Taiguang;， Thickness: 0.50-8.0mm Min trace width/spacing: 0.076/0.076mm(3/3mil) Surface treatment; Immersion Gold Blind via L1-2 & L5-6: 0.1mm(4mil) Buried via L2-5: 0.2mm(8mil) Application: Military products hdi-pcb4electronic-board 2. High-density interconnection/HDI PCB Layer: 26(HDI) Structure: 3+18+3 with stagger via Material: FR4（Halogen free)FR4, High Tg FR4, Halogen Free FR4，High frequency mixing of MC24M, 3M, SOAL, Connie, Rogers, Teflon, DuPont, Panasonic, Taiyao, Taiguang; Thickness: 0.5-10.0mm Surface treatment; Immersion Gold Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1mm(4mil) Buried via L3-6: L2-3，L3-5，L4-6......L8-6,0.2mm(8mil) Impedance control: differential 750 & 500ohm Application: Communication hdi-pcb5pcb-proto 3. High-density interconnection/HDI PCB Layer: 60L(HDI) Structure: 4+N+4 with stack via Material: FR4(Tg170),High Tg FR4, Halogen Free FR4，High frequency mixing of MC24M, 3M, SOAL, Connie, Rogers, Teflon, DuPont, Panasonic, Taiyao, Thickness: 0.8-14mm Surface treatment; Selective Immersion Gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8:,L8-9 .....0.1mm(4mil) Buried via L3-6: 0.2mm(8mil) Special process: Copper-filled on L2-3 3L-4,5-6& L6-7,L7-8,L8-9..... Application: aviation














Japan Chuanshan Circuit Board Equipment Co., Ltd. was established in 1982, has experienced more than 30 years of growth and development. Over the years, we are committed to the development and manufacture of circuit board equipment for the circuit board industry to provide superior quality products and high quality Our main products include: Horizontal Wet Process Line, Cabinet and Tunnel Oven and Peripheral Automation Equipment. 1982 - 2008 We focus on Japan and Europe and the US market, 2010 We are in China And Southeast Asia and other regions, serving more than 500 circuit board manufacturers, is Japan's largest manufacturer of circuit board equipment one of the superior production results, handy operation, simple and efficient maintenance and safe and reliable operating system design concepts are It is the leading edge of the circuit board equipment industry, and has always been committed to the development and manufacture of circuit board equipment and ISO quality management system international standard. It is the quality of continuous operation of Chuanshan The company has developed a quality manual that meets ISO requirements, identifies service standards, document control systems, and speaks for all Related courses, in August 1985 and August 1990, respectively, passed the ISO-900 and ISO9001: 2000 BSI international certification. In September 1995, Chuan Shan successfully passed DNV certification CE, which not only proved that the Chuan Shan The results of efforts over the years, but also fully shows that we have been in progress, to make better products and efforts to enable customers in the production process as well as product quality to obtain greater protection.We use high precision CAD / CAM and the most Advanced simulation system to establish the unit structure, to its program, greatly improving the stability and reliability of the machine.We believe that advanced machinery and equipment and continuous improvement of production technology is the guarantee of high quality products.Therefore, we continue to introduce A large number of automated production systems, coupled with professional technical staff to meet the increasing quality of customer requirements. Chuan Shan has more than 1,000 professional technical staff, in accordance with the requirements of the project, provided by the Department of professional design and specification review, production Responsible for precision manufacturing and assembly, QC is rigorously tested to ensure the high quality of the product.With the increasing technical requirements of the industry, we have systematically More than 80 professionals from Japan and the United States are responsible for the development of research work, through their rich experience, the development of more advanced production technology and the development of high-quality, high-precision, Products, so that Katsuyama to maintain the leadership position in the market.In order to allow customers to fully appreciate the spirit of service Sichuan, we consider the needs of customers from various aspects and provide assistance; such as technical support, the effective supply of spare parts and professional advice To provide, etc. There are well-trained technical staff responsible for the installation of the machinery and equipment, operation training and maintenance works, Mu can provide the most complete after-sales service. Welcome to have the skills of the community to join!